Non-destructive Anomaly Detection Method for Wire Bonding Using a Thin Film AE Sensor
نویسندگان
چکیده
منابع مشابه
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ژورنال
عنوان ژورنال: Transactions of The Japan Institute of Electronics Packaging
سال: 2019
ISSN: 1883-3365,1884-8028
DOI: 10.5104/jiepeng.12.e19-001-1